Semiconductor manufacturer Infineon Technologies has launched two new 1,200 V EasyPACK modules with SiC MOSFETs as part of its 1,200 V series. Infineon says the new product is designed to meet the growing demand for silicon carbide (SiC) solutions.
Both the Easy 1B and Easy 2B integrate Infineon’s CoolSiC MOSFETs and are aimed at both the EV market and UPS applications. Infineon designed the Easy 1B to serve the DC/DC stage of the charging station. The Easy 2B holds a three-level configuration that is suited for the Vienna Rectifier usually implemented in this application for the PFC stage.
In combination, the power modules can be used for 50/60 kW EV charging solutions. Higher-frequency operation is possible.
The EasyPACK standard package for power modules is characterized
by a low stray inductance. Infineon says this helps in building up stacked
modular solutions for charging which can go up to 120/150 kW. The NTC
temperature sensor, which is also featured in the Easy modules, facilitates the
monitoring of the device and the PressFIT technology reduces assembly time for
mounting the device.